Wafer Grinding Equipment market is segmented by region (country), players, by Type, and by Application. Players, stakeholders, and other participants in the global Wafer Grinding Equipment market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on revenue and forecast by region (country), by Type and by Application in terms of revenue and forecast for the period 2015-2026.
Segment by Type, the Wafer Grinding Equipment market is segmented into
Wafer Edge Grinder
Wafer Surface Grinder
Segment by Application, the Wafer Grinding Equipment market is segmented into
Semiconductor
Photovoltaic
Regional and Country-level Analysis
The Wafer Grinding Equipment market is analysed and market size information is provided by regions (countries).
The key regions covered in the Wafer Grinding Equipment market report are North America, Europe, Asia Pacific, Latin America, Middle East and Africa. It also covers key regions (countries), viz, U.S., Canada, Germany, France, U.K., Italy, Russia, China, Japan, South Korea, India, Australia, Taiwan, Indonesia, Thailand, Malaysia, Philippines, Vietnam, Mexico, Brazil, Turkey, Saudi Arabia, U.A.E, etc.
The report includes country-wise and region-wise market size for the period 2015-2026. It also includes market size and forecast by Type, and by Application segment in terms of sales and revenue for the period 2015-2026.
Competitive Landscape and Wafer Grinding Equipment Market Share Analysis
Wafer Grinding Equipment market competitive landscape provides details and data information by players. The report offers comprehensive analysis and accurate statistics on revenue by the player for the period 2015-2020. It also offers detailed analysis supported by reliable statistics on revenue (global and regional level) by players for the period 2015-2020. Details included are company description, major business, company total revenue and the sales, revenue generated in Wafer Grinding Equipment business, the date to enter into the Wafer Grinding Equipment market, Wafer Grinding Equipment product introduction, recent developments, etc.
The major vendors covered:
Okamoto Semiconductor Equipment Division
Strasbaugh
Disco
G&N Genauigkeits Maschinenbau Nürnberg GmbH
GigaMat
Arnold Gruppe
Hunan Yujing Machine Industrial
WAIDA MFG
SpeedFam
Koyo Machinery
ACCRETECH
Daitron
MAT Inc.
Dikema Presicion Machinery
Dynavest
Komatsu NTC
1 Study Coverage
1.1 Wafer Grinding Equipment Product Introduction
1.2 Market Segments
1.3 Key Wafer Grinding Equipment Manufacturers Covered: Ranking by Revenue
1.4 Market by Type
1.4.1 Global Wafer Grinding Equipment Market Size Growth Rate by Type
1.4.2 Wafer Edge Grinder
1.4.3 Wafer Surface Grinder
1.5 Market by Application
1.5.1 Global Wafer Grinding Equipment Market Size Growth Rate by Application
1.5.2 Semiconductor
1.5.3 Photovoltaic
1.6 Study Objectives
1.7 Years Considered
2 Executive Summary
2.1 Global Wafer Grinding Equipment Market Size, Estimates and Forecasts
2.1.1 Global Wafer Grinding Equipment Revenue 2015-2026
2.1.2 Global Wafer Grinding Equipment Sales 2015-2026
2.2 Global Wafer Grinding Equipment, Market Size by Producing Regions: 2015 VS 2020 VS 2026
2.3 Wafer Grinding Equipment Historical Market Size by Region (2015-2020)
2.3.1 Global Wafer Grinding Equipment Retrospective Market Scenario in Sales by Region: 2015-2020
2.3.2 Global Wafer Grinding Equipment Retrospective Market Scenario in Revenue by Region: 2015-2020
2.4 Wafer Grinding Equipment Market Estimates and Projections by Region (2021-2026)
2.4.1 Global Wafer Grinding Equipment Sales Forecast by Region (2021-2026)
2.4.2 Global Wafer Grinding Equipment Revenue Forecast by Region (2021-2026)
3 Global Wafer Grinding Equipment Competitor Landscape by Players
3.1 Global Top Wafer Grinding Equipment Sales by Manufacturers
3.1.1 Global Wafer Grinding Equipment Sales by Manufacturers (2015-2020)
3.1.2 Global Wafer Grinding Equipment Sales Market Share by Manufacturers (2015-2020)
3.2 Global Wafer Grinding Equipment Manufacturers by Revenue
3.2.1 Global Wafer Grinding Equipment Revenue by Manufacturers (2015-2020)
3.2.2 Global Wafer Grinding Equipment Revenue Share by Manufacturers (2015-2020)
3.2.3 Global Wafer Grinding Equipment Market Concentration Ratio (CR5 and HHI) (2015-2020)
3.2.4 Global Top 10 and Top 5 Companies by Wafer Grinding Equipment Revenue in 2019
3.2.5 Global Wafer Grinding Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
3.3 Global Wafer Grinding Equipment Price by Manufacturers
3.4 Global Wafer Grinding Equipment Manufacturing Base Distribution, Product Types
3.4.1 Wafer Grinding Equipment Manufacturers Manufacturing Base Distribution, Headquarters
3.4.2 Manufacturers Wafer Grinding Equipment Product Type
3.4.3 Date of International Manufacturers Enter into Wafer Grinding Equipment Market
3.5 Manufacturers Mergers & Acquisitions, Expansion Plans
4 Market Size by Type (2015-2026)
4.1 Global Wafer Grinding Equipment Market Size by Type (2015-2020)
4.1.1 Global Wafer Grinding Equipment Sales by Type (2015-2020)
4.1.2 Global Wafer Grinding Equipment Revenue by Type (2015-2020)
4.1.3 Wafer Grinding Equipment Average Selling Price (ASP) by Type (2015-2026)
4.2 Global Wafer Grinding Equipment Market Size Forecast by Type (2021-2026)
4.2.1 Global Wafer Grinding Equipment Sales Forecast by Type (2021-2026)
4.2.2 Global Wafer Grinding Equipment Revenue Forecast by Type (2021-2026)
4.2.3 Wafer Grinding Equipment Average Selling Price (ASP) Forecast by Type (2021-2026)
4.3 Global Wafer Grinding Equipment Market Share by Price Tier (2015-2020): Low-End, Mid-Range and High-End
5 Market Size by Application (2015-2026)
5.1 Global Wafer Grinding Equipment Market Size by Application (2015-2020)
5.1.1 Global Wafer Grinding Equipment Sales by Application (2015-2020)
5.1.2 Global Wafer Grinding Equipment Revenue by Application (2015-2020)
5.1.3 Wafer Grinding Equipment Price by Application (2015-2020)
5.2 Wafer Grinding Equipment Market Size Forecast by Application (2021-2026)
5.2.1 Global Wafer Grinding Equipment Sales Forecast by Application (2021-2026)
5.2.2 Global Wafer Grinding Equipment Revenue Forecast by Application (2021-2026)
5.2.3 Global Wafer Grinding Equipment Price Forecast by Application (2021-2026)
6 China by Players, Type and Application
6.1 China Wafer Grinding Equipment Market Size YoY Growth 2015-2026
6.1.1 China Wafer Grinding Equipment Sales YoY Growth 2015-2026
6.1.2 China Wafer Grinding Equipment Revenue YoY Growth 2015-2026
6.1.3 China Wafer Grinding Equipment Market Share in Global Market 2015-2026
6.2 China Wafer Grinding Equipment Market Size by Players (International and Local Players)
6.2.1 China Top Wafer Grinding Equipment Players by Sales (2015-2020)
6.2.2 China Top Wafer Grinding Equipment Players by Revenue (2015-2020)
6.3 China Wafer Grinding Equipment Historic Market Review by Type (2015-2020)
6.3.1 China Wafer Grinding Equipment Sales Market Share by Type (2015-2020)
6.3.2 China Wafer Grinding Equipment Revenue Market Share by Type (2015-2020)
6.3.3 China Wafer Grinding Equipment Price by Type (2015-2020)
6.4 China Wafer Grinding Equipment Market Estimates and Forecasts by Type (2021-2026)
6.4.1 China Wafer Grinding Equipment Sales Forecast by Type (2021-2026)
6.4.2 China Wafer Grinding Equipment Revenue Forecast by Type (2021-2026)
6.4.3 China Wafer Grinding Equipment Price Forecast by Type (2021-2026)
6.5 China Wafer Grinding Equipment Historic Market Review by Application (2015-2020)
6.5.1 China Wafer Grinding Equipment Sales Market Share by Application (2015-2020)
6.5.2 China Wafer Grinding Equipment Revenue Market Share by Application (2015-2020)
6.5.3 China Wafer Grinding Equipment Price by Application (2015-2020)
6.6 China Wafer Grinding Equipment Market Estimates and Forecasts by Application (2021-2026)
6.6.1 China Wafer Grinding Equipment Sales Forecast by Application (2021-2026)
6.6.2 China Wafer Grinding Equipment Revenue Forecast by Application (2021-2026)
6.6.3 China Wafer Grinding Equipment Price Forecast by Application (2021-2026)
7 North America
7.1 North America Wafer Grinding Equipment Market Size YoY Growth 2015-2026
7.2 North America Wafer Grinding Equipment Market Facts & Figures by Country
7.2.1 North America Wafer Grinding Equipment Sales by Country (2015-2020)
7.2.2 North America Wafer Grinding Equipment Revenue by Country (2015-2020)
7.2.3 U.S.
7.2.4 Canada
8 Europe
8.1 Europe Wafer Grinding Equipment Market Size YoY Growth 2015-2026
8.2 Europe Wafer Grinding Equipment Market Facts & Figures by Country
8.2.1 Europe Wafer Grinding Equipment Sales by Country
8.2.2 Europe Wafer Grinding Equipment Revenue by Country
8.2.3 Germany
8.2.4 France
8.2.5 U.K.
8.2.6 Italy
8.2.7 Russia
9 Asia Pacific
9.1 Asia Pacific Wafer Grinding Equipment Market Size YoY Growth 2015-2026
9.2 Asia Pacific Wafer Grinding Equipment Market Facts & Figures by Country
9.2.1 Asia Pacific Wafer Grinding Equipment Sales by Region (2015-2020)
9.2.2 Asia Pacific Wafer Grinding Equipment Revenue by Region
9.2.3 China
9.2.4 Japan
9.2.5 South Korea
9.2.6 India
9.2.7 Australia
9.2.8 Taiwan
9.2.9 Indonesia
9.2.10 Thailand
9.2.11 Malaysia
9.2.12 Philippines
9.2.13 Vietnam
10 Latin America
10.1 Latin America Wafer Grinding Equipment Market Size YoY Growth 2015-2026
10.2 Latin America Wafer Grinding Equipment Market Facts & Figures by Country
10.2.1 Latin America Wafer Grinding Equipment Sales by Country
10.2.2 Latin America Wafer Grinding Equipment Revenue by Country
10.2.3 Mexico
10.2.4 Brazil
10.2.5 Argentina
11 Middle East and Africa
11.1 Middle East and Africa Wafer Grinding Equipment Market Size YoY Growth 2015-2026
11.2 Middle East and Africa Wafer Grinding Equipment Market Facts & Figures by Country
11.2.1 Middle East and Africa Wafer Grinding Equipment Sales by Country
11.2.2 Middle East and Africa Wafer Grinding Equipment Revenue by Country
11.2.3 Turkey
11.2.4 Saudi Arabia
11.2.5 U.A.E
12 Company Profiles
12.1 Okamoto Semiconductor Equipment Division
12.1.1 Okamoto Semiconductor Equipment Division Corporation Information
12.1.2 Okamoto Semiconductor Equipment Division Description and Business Overview
12.1.3 Okamoto Semiconductor Equipment Division Sales, Revenue and Gross Margin (2015-2020)
12.1.4 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Products Offered
12.1.5 Okamoto Semiconductor Equipment Division Recent Development
12.2 Strasbaugh
12.2.1 Strasbaugh Corporation Information
12.2.2 Strasbaugh Description and Business Overview
12.2.3 Strasbaugh Sales, Revenue and Gross Margin (2015-2020)
12.2.4 Strasbaugh Wafer Grinding Equipment Products Offered
12.2.5 Strasbaugh Recent Development
12.3 Disco
12.3.1 Disco Corporation Information
12.3.2 Disco Description and Business Overview
12.3.3 Disco Sales, Revenue and Gross Margin (2015-2020)
12.3.4 Disco Wafer Grinding Equipment Products Offered
12.3.5 Disco Recent Development
12.4 G&N Genauigkeits Maschinenbau Nürnberg GmbH
12.4.1 G&N Genauigkeits Maschinenbau Nürnberg GmbH Corporation Information
12.4.2 G&N Genauigkeits Maschinenbau Nürnberg GmbH Description and Business Overview
12.4.3 G&N Genauigkeits Maschinenbau Nürnberg GmbH Sales, Revenue and Gross Margin (2015-2020)
12.4.4 G&N Genauigkeits Maschinenbau Nürnberg GmbH Wafer Grinding Equipment Products Offered
12.4.5 G&N Genauigkeits Maschinenbau Nürnberg GmbH Recent Development
12.5 GigaMat
12.5.1 GigaMat Corporation Information
12.5.2 GigaMat Description and Business Overview
12.5.3 GigaMat Sales, Revenue and Gross Margin (2015-2020)
12.5.4 GigaMat Wafer Grinding Equipment Products Offered
12.5.5 GigaMat Recent Development
12.6 Arnold Gruppe
12.6.1 Arnold Gruppe Corporation Information
12.6.2 Arnold Gruppe Description and Business Overview
12.6.3 Arnold Gruppe Sales, Revenue and Gross Margin (2015-2020)
12.6.4 Arnold Gruppe Wafer Grinding Equipment Products Offered
12.6.5 Arnold Gruppe Recent Development
12.7 Hunan Yujing Machine Industrial
12.7.1 Hunan Yujing Machine Industrial Corporation Information
12.7.2 Hunan Yujing Machine Industrial Description and Business Overview
12.7.3 Hunan Yujing Machine Industrial Sales, Revenue and Gross Margin (2015-2020)
12.7.4 Hunan Yujing Machine Industrial Wafer Grinding Equipment Products Offered
12.7.5 Hunan Yujing Machine Industrial Recent Development
12.8 WAIDA MFG
12.8.1 WAIDA MFG Corporation Information
12.8.2 WAIDA MFG Description and Business Overview
12.8.3 WAIDA MFG Sales, Revenue and Gross Margin (2015-2020)
12.8.4 WAIDA MFG Wafer Grinding Equipment Products Offered
12.8.5 WAIDA MFG Recent Development
12.9 SpeedFam
12.9.1 SpeedFam Corporation Information
12.9.2 SpeedFam Description and Business Overview
12.9.3 SpeedFam Sales, Revenue and Gross Margin (2015-2020)
12.9.4 SpeedFam Wafer Grinding Equipment Products Offered
12.9.5 SpeedFam Recent Development
12.10 Koyo Machinery
12.10.1 Koyo Machinery Corporation Information
12.10.2 Koyo Machinery Description and Business Overview
12.10.3 Koyo Machinery Sales, Revenue and Gross Margin (2015-2020)
12.10.4 Koyo Machinery Wafer Grinding Equipment Products Offered
12.10.5 Koyo Machinery Recent Development
12.11 Okamoto Semiconductor Equipment Division
12.11.1 Okamoto Semiconductor Equipment Division Corporation Information
12.11.2 Okamoto Semiconductor Equipment Division Description and Business Overview
12.11.3 Okamoto Semiconductor Equipment Division Sales, Revenue and Gross Margin (2015-2020)
12.11.4 Okamoto Semiconductor Equipment Division Wafer Grinding Equipment Products Offered
12.11.5 Okamoto Semiconductor Equipment Division Recent Development
12.12 Daitron
12.12.1 Daitron Corporation Information
12.12.2 Daitron Description and Business Overview
12.12.3 Daitron Sales, Revenue and Gross Margin (2015-2020)
12.12.4 Daitron Products Offered
12.12.5 Daitron Recent Development
12.13 MAT Inc.
12.13.1 MAT Inc. Corporation Information
12.13.2 MAT Inc. Description and Business Overview
12.13.3 MAT Inc. Sales, Revenue and Gross Margin (2015-2020)
12.13.4 MAT Inc. Products Offered
12.13.5 MAT Inc. Recent Development
12.14 Dikema Presicion Machinery
12.14.1 Dikema Presicion Machinery Corporation Information
12.14.2 Dikema Presicion Machinery Description and Business Overview
12.14.3 Dikema Presicion Machinery Sales, Revenue and Gross Margin (2015-2020)
12.14.4 Dikema Presicion Machinery Products Offered
12.14.5 Dikema Presicion Machinery Recent Development
12.15 Dynavest
12.15.1 Dynavest Corporation Information
12.15.2 Dynavest Description and Business Overview
12.15.3 Dynavest Sales, Revenue and Gross Margin (2015-2020)
12.15.4 Dynavest Products Offered
12.15.5 Dynavest Recent Development
12.16 Komatsu NTC
12.16.1 Komatsu NTC Corporation Information
12.16.2 Komatsu NTC Description and Business Overview
12.16.3 Komatsu NTC Sales, Revenue and Gross Margin (2015-2020)
12.16.4 Komatsu NTC Products Offered
12.16.5 Komatsu NTC Recent Development
13 Market Opportunities, Challenges, Risks and Influences Factors Analysis
13.1 Market Opportunities and Drivers
13.2 Market Challenges
13.3 Market Risks/Restraints
13.4 Porter’s Five Forces Analysis
13.5 Primary Interviews with Key Wafer Grinding Equipment Players (Opinion Leaders)
14 Value Chain and Sales Channels Analysis
14.1 Value Chain Analysis
14.2 Wafer Grinding Equipment Customers
14.3 Sales Channels Analysis
14.3.1 Sales Channels
14.3.2 Distributors
15 Research Findings and Conclusion
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
Okamoto Semiconductor Equipment Division
Strasbaugh
Disco
G&N Genauigkeits Maschinenbau Nürnberg GmbH
GigaMat
Arnold Gruppe
Hunan Yujing Machine Industrial
WAIDA MFG
SpeedFam
Koyo Machinery
ACCRETECH
Daitron
MAT Inc.
Dikema Presicion Machinery
Dynavest
Komatsu NTC
*If Applicable.